Model | LPCVD | PECVD | Boron Diffusion/RP | Boron-Oxidation/OX |
Operating Temperature | 500℃~700℃ | 200~600℃ | 800~1000℃ | 900℃~1050℃ |
Heat Insulator | Vacuum Adsorption Process 300kg/m³ | |||
Thermal Conductivity
(w/M·K) |
at 400℃: 0.103
at 600℃: 0.137 at 800℃: 0.164 |
at 400℃: 0.107
at 600℃: 0.149 at 800℃: 0.179 at 1000℃: 0.233 |
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Temperature Uniformity | at700℃±1℃ | at 600℃±1℃ | at 1000℃±1℃ | at 1050℃±1℃ |
Heating Element | Wound or Ribbon FeCrAl, directly embedded into heat-resistant materials | |||
Support | Unique Fiber Process Structure | |||
Suitable Tube Size | 380-540mm | |||
Lifespan | >18 months | > 24 months | >12 months | >12 months |
Photovoltaic/Semiconductor Equipment | |
Low-pressure Horizontal Diffusion System | Low-pressure Horizontal Oxidation Annealing System |
Low-pressure Horizontal Chemical Vapor Deposition Coating System (LPCVD) | Plasma Enhanced Chemical Vapor Deposition Coating System (PECVD TWIN) |
Horizontal Plasma Enhanced Atomic Layer Deposition Coating System (PEALD) | Plasma Enhanced Chemical Vapor Deposition Horizontal Coating System (PECVD VEGA) |
Atomic Layer Deposition System (ALD) | Ultra-High-Temperature Heat Treatment Equipment |